Epoxy Molding Compound

Epoxy Molding Compound ( EMC ) is a kind of electronic material applied in the package of semiconductor apparatus and IC chip .

环氧塑封料（EpoxyMoldingCompound）是一种半导体封装用电子材料，主要应用于半导体器件和集成电路芯片的封装。

Epoxy Molding Compound Technology Selection and Reliability Analysis

环氧塑封料的工艺选择及可靠性分析

Study on Parameters Affecting Properties of Epoxy Molding Compound for Integrated Circuit Packaging

集成电路封装用环氧树脂模塑料性能影响因素研究

Development of carbon fiber reinforced epoxy molding compound

碳纤维增强环氧模塑料的研制

Application of epoxy molding compound and polyester molding compound on coil packaging

环氧模塑料和聚酯模塑料在线圈封装中的应用

Epoxy molding compound , die attachment and substrate existed moisture gradient .

塑封料、基板和芯片粘接剂之间存在一定的湿度梯度。

The Thermo-Mechanical Stress Analysis of Epoxy Molding Compound in PBGA

PBGA中环氧模塑封装材料的热力学应力分析

Waste Epoxy Molding Compound Powder ;

废环氧模塑料粉；

Study of the Dispersion and Toughness on the Epoxy Molding Compound with Core-shell Elastic Particles plastic dual in line package

核壳橡胶在环氧模塑料中分散及增韧改性研究

Tension and fatigue tests on a widely used packaging epoxy molding compound ( EMC ) were performed under room and high temperatures .

对在微电子封装中应用很广的环氧模塑封装材料进行了常温和高温下的拉伸、疲劳实验。

Thermal Conductive Performance and Thermal Simulation of High Thermal Conductive Epoxy Molding Compound Thermal Conductivity of the Carbon Nanotube / Silicone Grease Composite

内嵌金属导热通道环氧模塑料导热性能与模拟碳纳米管/导热硅脂复合材料的导热性能

The performance of epoxy molding compound , its relationship between the property and component , modification methods and its development trends were narrated in detail .

重点阐述了环氧塑封料的性能、性能与组分间的关系、改进方法以及发展趋势；

Epoxy molding compound is playing an important role in the development of micro-electronics package technology . This article will expound the development course , current situation and future trend of EMC .

环氧塑封料（EpoxyMoldingCompound，EMC）对微电子封装技术的发展起着很重要的作用，将从环氧塑封料的发展历程、发展现状以及未来的发展趋势进行阐述。

The Epoxy Molding Compound ( EMC ) has extensively used as an encapsulant for electronic packages to protect the IC chips from mechanical and chemical hazards .

环氧模塑封（EMC）材料已广泛应用于微电子封装，为集成电路芯片提供机械支撑并保护集成电路芯片免受化学危害。

The method of polypyrrole ( PPy ) films being synthesized on the surface of insulating epoxy molding compound ( EMC ) electronic packaging materials and the shielding effectiveness of PPy film were studied .

研究了将导电聚吡咯（PPy）薄膜制备在绝缘环氧模塑料（EMC）电子封装材料表面的方法，及导电PPy薄膜的电磁屏蔽效能。

The optimization design was done for top module ; increasing the chip thickness and coefficient of thermal expansion of epoxy molding compound and reducing the thickness of substrate were helpful to improve the thermal reliability under certain conditions .

针对顶部模块进行了优化设计，在一定条件下，增加芯片厚度和塑封料热膨胀系数、减小基板厚度有利于提高热可靠性。

This paper is mainly studying the development status of Epoxy Molding Compound by the development course and the typical technology and the manufacture craftwork and the development status of all the world and the marketing application of EMC and so on .

文章主要是通过对环氧塑封料的发展历程、典型技术和制造工艺，以及国内外发展状况和市场应用等方面的研究，对全球的环氧塑封料的发展状况进行浅析。

After moisture absorption , substrate as well as most epoxy molding compound and bottom die attachment had reached saturated humidity in the top module . For bottom module , the epoxy molding compound , die attachment and substrate all reached saturated humidity .

吸湿后，顶部模块中的基板、大部分塑封料以及下层芯片粘接剂已达饱和湿度，底部模块的塑封料、芯片粘接剂和基板均达到饱和湿度。

Study on the curing reaction kinetics of epoxy electrician molding compound

环氧电工塑料的固化反应动力学研究

Study on Fiber Reinforced Epoxy Sheet Molding Compound

模压成型纤维增强环氧片状模塑料的研究

Preparation of glass fiber reinforced modified novolac & type epoxy resin molding compound

改性酚醛型环氧玻璃纤维压塑料的研制

Dynamic modeling of composite rotor blade with piezoelectric fiber Study on Fiber Reinforced Epoxy Sheet Molding Compound

压电纤维复合材料桨叶的动力学建模模压成型纤维增强环氧片状模塑料的研究

Research and application of epoxy plasticizer from renewable raw materials Study of the Dispersion and Toughness on the Epoxy Molding Compound with Core-shell Elastic Particles

用可再生性原料合成环氧增塑剂的研究进展核壳橡胶在环氧模塑料中分散及增韧改性研究